Responsibility

• Lead trade-off analysis, integration, performance optimizations, and system definition/design of Innovative Computer Vision Systems, with emphasis on depth sensor technology, and optical modules.
• Lead integration and optimization of a state-of-the-art System-on-a-chip (SoC) that includes multiple computing systems and Computer Vision accelerators.
• Lead system definition, and integration of an advanced cameras and sensing modules used in the fields of AR/VR, Robotics, in collaboration with HW and SW teams, experimental work and data analysis and characterization measurements.
• Cross-team and cross-discipline technological project leadership

Requirements

• BSc Physics or Electrical Engineering from a leading university, MSc or dual degree in EE and Physics are an advantage.
• Experience with low-level integration of SoC/ASICs (bring up of ASIC modules, register level configurations, etc.) is a MUST.
• At least 3 years of proven experience in system engineering of multi-disciplinary systems, that includes SoC/ASICs.
• Extensive hands-on experience, adept with SoC/ASIC integration and debugging, and with system-level experimental procedures.
• Experience in Computer Vision Systems is an advantage.
• Good social skills – a “can do” attitude and ability to work in a team – must.
• Multidisciplinary understanding, all the way from SoC through HW, FW, SW to algorithms and system-level performance.
• Matlab or Python skills – must.
• Familiar with image processing algorithms.
• In depth experience in advanced 3D sensing technologies and/or tracking systems is an advantage.
• Experience with product hand off to manufacturing is an advantage.